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NXP^® i.MX 8QuadXPlus, 4x Arm Cortex™-A35, 1.2GHz (A35) , 266MHz (M4) , 640MHz (DSP), 2GB DDR3L (32 Bit), 8GB eMMC, Gigabit with AVB (+2nd RGMII/RMII) Ethernet, -40° to +85° C Temp. Range, Availability until 2030+

NVIDIA^® Tegra™ 3, 1x Arm Cortex™-A9, Up to 1.4 GHz, 2GB DDR3L (32 Bit), 8GB eMMC (8 Bit), 10/100/1000 Mbit with IEEE 1588 Ethernet, 0° to 70° C Temp. Range, Availability until 2025

NVIDIA^® Tegra™ 3, 4x Arm Cortex™-A9, Up to 1.4 GHz, 2GB DDR3L (32 Bit), 8GB eMMC, Gigabit with IEEE 1588 Ethernet, 0° to 70° C Temp. Range, Availability until 2025

NVIDIA^® Tegra™ 3, 4x Arm Cortex™-A9, Up to 1.4 GHz, 1GB DDR3L (32 Bit), 4GB eMMC, Gigabit with IEEE 1588 Ethernet, 0° to 70° C Temp. Range, Availability until 2025

NVIDIA^® Tegra™ 3, Arm Cortex™-A9, Up to 1.4 GHz, 1GB DDR3L (32 Bit), 4GB eMMC (8 Bit), Gigabit with IEEE 1588 Ethernet, 0° to 70° C Temp. Range, Availability until 2025

NVIDIA^® Tegra™ 3, 4x Arm Cortex™-A9, Up to 1.4 GHz, 1GB DDR3L (32 Bit), 4GB eMMC, Gigabit with IEEE 1588 Ethernet, -40° to +85° C Temp. Range, Availability until 2025

NXP^® i.MX 6Quad, 4x Arm Cortex™-A9, 800 MHz , 2GB DDR3 (64 Bit), 4GB eMMC, Gigabit with IEEE 1588 Ethernet, -40° to +85° C Temp. Range, Availability until 2028

NXP^® i.MX 6Quad, 4x Arm Cortex™-A9, 1.0 GHz, 1GB DDR3 (64 Bit), 4GB eMMC, Gigabit with IEEE 1588 Ethernet, 0° to 70° C Temp. Range, Availability until 2028

NXP^® i.MX 6Dual, 2x Arm Cortex™-A9, 800 MHz , 1GB DDR3 (64 Bit), 4GB eMMC, Gigabit with IEEE 1588 Ethernet, -40° to +85° C Temp. Range, Availability until 2028

NXP^® i.MX 6Dual, 2x Arm Cortex™-A9, 1.0 GHz, 512MB DDR3 (64 Bit), 4GB eMMC, Gigabit with IEEE 1588 Ethernet, 0° to 70° C Temp. Range, Availability until 2028

Small form-factor Apalis Arm Computer Module family Carrier Board

Connectivity: USB 3.0: 2x Host, USB 2.0: 1x Host / 1x OTG, Gigabit Ethernet, 2x I2C, 1x SPI, 4x PWM, 4x ADC, 2x CAN, 2x LEDs, up to 40 GPIOs

Multimedia: Audio out: 1x (Stereo), Audio in: 1x (Stereo), 1x / 1x S/PDIF In / Out, 1x 10 Bit Camera Parallel Interface, 4/5-wire Resistive Touch

Physical: 7-27V DC Supply Voltage, 5V 5A, 3.3V 5A On-Board Power Supplies, Size: 125 x 90 mm

Connectivity: USB 3.0: 1x Host, 1x OTG, USB 2.0: 4x Host, Gigabit Ethernet, 3x I2C, 2x SPI, 4x PWM, 4x ADC, 2x CAN, 8x Switches, 8x LEDs, up to 135 GPIOs

Multimedia: Audio out: 1x (Stereo), Audio in: 1x (Stereo), 1x (Out also on TOSLINK) S/PDIF In / Out, 1x 8/10/12 Bit Camera Parallel Interface, 4/5-wire Resistive Touch

Physical: 7-27V DC Supply Voltage, 5V 5A, 3.3V 5A On-Board Power Supplies, Size: 250 x 250 mm

NXP^® i.MX 8QuadXPlus, 4x Arm Cortex™-A35, 1.2GHz (A35) , 266MHz (M4) , 640MHz (DSP), 2GB LPDDR4 (32 Bit), 8GB eMMC, 10/100 Mbit with AVB (+2nd RGMII/RMII) Ethernet, -40° to +85° C Temp. Range, Availability until 2030+

NXP^® i.MX 8DualX, 2x Arm Cortex™-A35, 1.2GHz (A35), 266MHz (M4), 1GB LPDDR4 (16 Bit), 4GB eMMC, 10/100 Mbit with AVB (+2nd RGMII/RMII) Ethernet, -25° to +85° C Temp. Range, Availability until 2030+

NXP^® i.MX 8DualX, 2x Arm Cortex™-A35, 1.2GHz (A35), 266MHz (M4), 1GB LPDDR4 (16 Bit), 4GB eMMC, 10/100 Mbit with AVB (+2nd RGMII/RMII) Ethernet, -25° to +85° C Temp. Range, Availability until 2030+