NXP^® i.MX 8M Plus, 4x Arm Cortex™-A53, 1.6 GHz (A53), 800 MHz (M7F), 4GB LPDDR4 (32 bit), 32GB eMMC, Gigabit with TSN (+2nd RGMII) Ethernet, -40° to +85° C⁽¹⁾ Temp. Range, Availability until 2036+

NXP^® i.MX 8M Plus, 4x Arm Cortex™-A53, 1.6 GHz (A53), 800 MHz (M7F), 4GB LPDDR4 (32 bit), 32GB eMMC, Gigabit with TSN (+2nd RGMII) Ethernet, -40° to 85° C Temp. Range, Availability until 2036+

NXP^® i.MX 8M Mini, 4x Arm Cortex™-A53, 1.6 GHz (A53), 400 MHz (M4F), 2GB LPDDR4 (32-bit), 16GB eMMC, Gigabit with AVB Ethernet, -40° to +85° C⁽¹⁾ Temp. Range, Availability until 2035+

NXP^® i.MX 8M Mini, 4x Arm Cortex™-A53, 1.6 GHz (A53), 400 MHz (M4F), 2GB LPDDR4 (32-bit), 16GB eMMC, Gigabit with AVB Ethernet, -40° to 85° C Temp. Range, Availability until 2035+

NXP^® i.MX 8M Mini, 2x Arm Cortex™-A53, 1.6 GHz (A53), 400 MHz (M4F), 1GB LPDDR4 (32bit), 8GB eMMC, Gigabit with AVB Ethernet, -40° to +85° C⁽¹⁾ Temp. Range, Availability until 2035+

NXP^® i.MX 8M Mini, 2x Arm Cortex™-A53, 1.8 GHz (A53), 400 MHz (M4F), 1GB LPDDR4 (32bit), 4GB eMMC, Gigabit with AVB Ethernet, 0° to 70° C Temp. Range, Availability until 2035+

Connectivity: USB 3.0: 2x USB-A (Host), USB 2.0: 1x USB-C (DualRole), 2x Gigabit Ethernet, 4x I2C, 1x SPI, 3x PWM, 4x ADC, 2x CAN, Up to 98x GPIOs

Multimedia: Audio out: 1x (Stereo), Audio in: 1x (Stereo).

Physical: 7-24V DC ±10% Supply Voltage, Size: 250mm x 200mm

Connectivity: USB 3.0: 2x USB-A (Host), USB 2.0: 1x USB-C (DualRole), 2x Gigabit Ethernet, 4x I2C, 1x SPI, 3x PWM, 4x ADC, 2x CAN, Up to 98x GPIOs

Multimedia: Audio out: 1x (Stereo), Audio in: 1x (Stereo).

Physical: 7-24V DC ±10% Supply Voltage, Size: 250mm x 200mm

Connectivity: USB 3.0: 2x USB-A (Host), USB 2.0: 1x USB-C (DualRole), 1x Gigabit Ethernet, 3x I2C, 1x SPI, 3x PWM, 4x ADC, 1x CAN, Up to 47x GPIOs

Multimedia: Audio out: 1x (Stereo), Audio in: 1x (Stereo).

Physical: 5-24V DC ±10% or USB-C (PD and BC) Supply Voltage, Size: 120mm x 120mm

Connectivity: USB 3.0: 1x USB-A (Host), USB 2.0: 1x USB-A (Host), 1x USB-C (DualRole), 1x Gigabit Ethernet, 2x I2C, 1x SPI, 2x PWM, 4x ADC, 1x Via transceiver/ 1x On extension connector CAN, 31x GPIOs

Multimedia:

Physical: 8-25V DC ±10% Supply Voltage, Size: 120mm x 120mm

Heatsink for Verdin iMX8M Mini and iMX8M Plus modules

Compatible with Verdin iMX8M Mini and Verdin iMX8M Plus. 4 screws (M2x10mm) included with each heatsink for easy mounting to Verdin Carrier Boards, Range. Size: 85.6 x 38 x 14.27 mm.

Heatsink for Verdin iMX8M Mini and iMX8M Plus modules

Compatible with Verdin iMX8M Mini and Verdin iMX8M Plus. 4 screws (M2x10mm) included with each heatsink for easy mounting to Verdin Carrier Boards, Range. Size: 85.6 x 38 x 14.27 mm.

Capacitive Touch Displays (LVDS) for Apalis modules

LVDS cable (250mm) and 10 pin FFC cable (250mm) to connect it with a Carrier Board. -20° to +70° C Temp, Range. Size: 248.5 x 166.1 x 15.0 mm.

Accessory kit for Toradex carrier boards

Power Adapter: 12VDC 30W with international plugs. Compatible with: Apalis Evaluation Board, Ixora Carrier Board, Colibri Evaluation Board, Iris Carrier Board, Verdin Development Board, Dahlia Carrier Board.

Cable length: 100mm. Frequency bands: 2.4 GHz and 5 GHz (dual-band). Manufacturer: Unictron. Reference: AA222 (H2B1PD1A1C385L), Range. Size: 40.0 x 6.0 x 0.5 mm.

Frequency bands: 2.4 GHz and 5 GHz (dual-band). Manufacturer: Chang Hong. Reference: DA-2458-02, Range. Size: 106.0 x 10.0 (max. diameter) mm.

Cable length: 100mm.

Cable length: 200mm.

Cable length: 200mm. Suitable for outdoor-usage (IP67).

Mezzanine board for Verdin iMX8M Plus module

-30° to +85° C Temp, Range. Size: 88 mm x 48 mm.