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Small form-factor Apalis Arm Computer Module family Carrier Board

Connectivity: USB 3.0: 2x Host, USB 2.0: 1x Host / 1x OTG, Gigabit Ethernet, 2x I2C, 1x SPI, 4x PWM, 4x ADC, 2x CAN, 2x LEDs, up to 40 GPIOs

Multimedia: Audio out: 1x (Stereo), Audio in: 1x (Stereo), 1x / 1x S/PDIF In / Out, 1x 10 Bit Camera Parallel Interface, 4/5-wire Resistive Touch

Physical: 7-27V DC Supply Voltage, 5V 5A, 3.3V 5A On-Board Power Supplies, Size: 125 x 90 mm

Connectivity: USB 3.0: 1x Host, 1x OTG, USB 2.0: 4x Host, Gigabit Ethernet, 3x I2C, 2x SPI, 4x PWM, 4x ADC, 2x CAN, 8x Switches, 8x LEDs, up to 135 GPIOs

Multimedia: Audio out: 1x (Stereo), Audio in: 1x (Stereo), 1x (Out also on TOSLINK) S/PDIF In / Out, 1x 8/10/12 Bit Camera Parallel Interface, 4/5-wire Resistive Touch

Physical: 7-27V DC Supply Voltage, 5V 5A, 3.3V 5A On-Board Power Supplies, Size: 250 x 250 mm

Heatsink for Apalis iMX6Q IT and Apalis iMX6D IT modules

Compatible with Apalis iMX6Q IT and Apalis iMX6D IT, Easily mounted to the Apalis Carrier Boards by means of 4 screws, Additional threaded holes available for attaching fan to the carrier board, -40°C to +200°C Temp.

Heatsink for Apalis T30 module

Compatible with Apalis T30, Easily mounted to the Apalis Carrier Boards by means of 4 screws, Additional threaded holes available for attaching fan to the carrier board.

Heatsink for Apalis TK1, iMX6Q and iMX6D modules

Compatible with Apalis iMX6Q, Apalis iMX6D and Apalis TK1, Easily mounted to the Apalis Carrier Boards by means of 4 screws, Additional threaded holes available for attaching fan to the carrier board, -40°C to +200°C Temp.

Heatsink for Apalis iMX8QM modules

Compatible with Apalis iMX8QM, Easily mounted to the Apalis Carrier Boards by means of 4 screws, Additional threaded holes available for attaching fan to the carrier board.

Mezzanine board for Apalis T30 module

CSI and DSI interfaces on one connector, Push button for Apalis T30 reset.

Mezzanine board for Apalis iMX6 module

1x Tactile switch to enter Apalis iMX6 module recovery mode, 1x Tactile switch to reset Apalis iMX6 module, -40° to +85° C Temp, Range. Size: 100 x 60 mm.

Mezzanine board for Apalis TK1 module

1x DSI and 3x MIPI CSI connectors, 1x Tactile switch to enter Apalis TK1 recovery mode, 1x Tactile switch to reset Apalis TK1 module.

NXP^® i.MX 8QuadXPlus, 4x Arm Cortex™-A35, 1.2GHz (A35) , 266MHz (M4) , 640MHz (DSP), 2GB LPDDR4 (32 Bit), 8GB eMMC, 10/100 Mbit with AVB (+2nd RGMII/RMII) Ethernet, -40° to +85° C Temp. Range, Availability until 2030+

NXP^® i.MX 8QuadXPlus, 4x Arm Cortex™-A35, 1.2GHz (A35) , 266MHz (M4) , 640MHz (DSP), 2GB LPDDR4 (32 Bit), 8GB eMMC, 10/100 Mbit with AVB (+2nd RGMII/RMII) Ethernet, -40° to +85° C Temp. Range, Availability until 2030+

NXP^® i.MX 8DualX, 2x Arm Cortex™-A35, 1.2GHz (A35), 266MHz (M4), 1GB LPDDR4 (16 Bit), 4GB eMMC, 10/100 Mbit with AVB (+2nd RGMII/RMII) Ethernet, -25° to +85° C Temp. Range, Availability until 2030+

NXP^® i.MX 8DualX, 2x Arm Cortex™-A35, 1.2GHz (A35), 266MHz (M4), 1GB LPDDR4 (16 Bit), 4GB eMMC, 10/100 Mbit with AVB (+2nd RGMII/RMII) Ethernet, -25° to +85° C Temp. Range, Availability until 2030+

NVIDIA^® Tegra™ 3, 4x Arm Cortex™-A9, Up to 1.4 GHz, 1GB DDR3L (32 Bit), 4GB eMMC, 10/100 Mbit Ethernet, 0° to 70° C Temp. Range, Availability until 2025

NVIDIA^® Tegra™ 3, 4x Arm Cortex™-A9, Up to 1.4 GHz, 1GB DDR3L (32 Bit), 4GB eMMC, 10/100 Mbit Ethernet, -40° to +85° C Temp. Range, Availability until 2025