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Using a Computer on Module (CoM) or Customized Single Board Computers (SBC) offers flexibility to system developers to focus on their application development by using an off-the-shelf product which has generic hardware and comes with production-ready software to kick start the development of a variety of applications.

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Results: 1-19 of 19 products.
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  • NXP® i.MX 8M Plus
  • 4x Arm Cortex™-A53
  • 1.6 GHz (A53), 800 MHz (M7F)
  • 8GB LPDDR4 (32 bit)
  • 32GB eMMC
  • -40° to 85° C(1) Temp
  • NXP® i.MX 8M Plus
  • 4x Arm Cortex™-A53
  • 1.6 GHz (A53), 800 MHz (M7F)
  • 4GB LPDDR4 (32 bit)
  • 32GB eMMC
  • -40° to 85° C(1) Temp
  • NXP® i.MX 8M Plus
  • 4x Arm Cortex™-A53
  • 1.6 GHz (A53), 800 MHz (M7F)
  • 4GB LPDDR4 (32 bit)
  • 32GB eMMC
  • -40° to 85° C Temp
  • NXP® i.MX 8M Plus
  • 4x Arm Cortex™-A53
  • 1.6 GHz (A53), 800 MHz (M7F)
  • 2GB LPDDR4 (32-bit)
  • 16GB eMMC
  • -40° to 85° C(1) Temp
  • NXP® i.MX 8M Plus
  • 4x Arm Cortex™-A53
  • 1.6 GHz (A53), 800 MHz (M7F)
  • 1GB LPDDR4 (32bit)
  • 8GB eMMC
  • -40° to 85° C Temp
  • NXP® i.MX 8M Mini
  • 4x Arm Cortex™-A53
  • 1.6 GHz (A53), 400 MHz (M4F)
  • 2GB LPDDR4 (32-bit)
  • 16GB eMMC
  • -40° to 85° C(1) Temp
  • NXP® i.MX 8M Mini
  • 4x Arm Cortex™-A53
  • 1.6 GHz (A53), 400 MHz (M4F)
  • 2GB LPDDR4 (32-bit)
  • 16GB eMMC
  • -40° to 85° C Temp
  • NXP® i.MX 8M Mini
  • 4x Arm Cortex™-A53
  • 1.6 GHz (A53), 400 MHz (M4F)
  • 2GB LPDDR4 (32-bit)
  • 16GB eMMC
  • -40° to 85° C(1) Temp
  • NXP® i.MX 8M Mini
  • 2x Arm Cortex™-A53
  • 1.6 GHz (A53), 400 MHz (M4F)
  • 1GB LPDDR4 (32bit)
  • 8GB eMMC
  • -40° to 85° C(1) Temp
  • NXP® i.MX 8M Mini
  • 2x Arm Cortex™-A53
  • 1.8 GHz (A53), 400 MHz (M4F)
  • 1GB LPDDR4 (32bit)
  • 4GB eMMC
  • 0° to 70° C Temp
  • TI AM 625
  • 4x Arm Cortex™-A53
  • 1.4 GHz (A53), 400 MHz (M4F)
  • 2GB LPDDR4 (16 Bit)
  • 16GB eMMC
  • -40° to 85° C(1) Temp
  • TI AM 625
  • 2x Arm Cortex™-A53
  • 1.4 GHz (A53), 400 MHz (M4F)
  • 1GB LPDDR4 (16 Bit)
  • 8GB eMMC
  • -40° to 85° C Temp
  • TI AM 625
  • 2x Arm Cortex™-A53
  • 1.4 GHz (A53), 400 MHz (M4F)
  • 1GB LPDDR4 (16 Bit)
  • 8GB eMMC
  • -40° to 85° C Temp
  • TI AM 623
  • 2x Arm Cortex™-A53
  • 1.4 GHz (A53), 400 MHz (M4F)
  • 1GB LPDDR4 (16 Bit)
  • 4GB eMMC
  • -25° to 85° C Temp
  • TI AM 623
  • 1x Arm Cortex™-A53
  • 1.0 GHz (A53), 400 MHz (M4F)
  • 512MB LPDDR4 (16 Bit)
  • 4GB eMMC
  • -40° to 85° C Temp
  • TI AM 623
  • 1x Arm Cortex™-A53
  • 800 MHz (A53), 400 MHz (M4F)
  • 512MB LPDDR4 (16 Bit)
  • 4GB eMMC
  • 0° to 70° C Temp
  • USB 3.0: 2x USB-A (Host)
  • USB 2.0: 1x USB-C (DualRole)
  • 2x Gigabit Ethernet
  • Size: 250mm x 200mm
  • USB 3.0: 2x USB-A (Host)
  • USB 2.0: 1x USB-C (DualRole)
  • 1x Gigabit Ethernet
  • Size: 120mm x 120mm
  • TI AM 69
  • Up to 8x Arm Cortex™-A72
  • 2.0 GHz (A72), 1.0 GHz (R5F)
  • Up to 32GB LPDDR4 (128-bit)
  • Up to 128GB eMMC
  • -40°C to 85° C Temp
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