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Using a Computer on Module (CoM) or Customized Single Board Computers (SBC) offers flexibility to system developers to focus on their application development by using an off-the-shelf product which has generic hardware and comes with production-ready software to kick start the development of a variety of applications.

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  • NXP® i.MX 8QuadMax
  • 2x Arm Cortex™-A72, 4x Arm Cortex™-A53
  • 1.6 GHz (A72), 1.26 GHz (A53), 266 MHz (M4)
  • 8GB LPDDR4 (64 bit)
  • 32GB eMMC
  • -40° to 85° C(1) Temp
  • NXP® i.MX 8QuadMax
  • 2x Arm Cortex™-A72, 4x Arm Cortex™-A53
  • 1.6 GHz (A72), 1.26 GHz (A53), 266 MHz (M4)
  • 4GB LPDDR4 (64 Bit)
  • 32GB eMMC
  • -40° to 85° C(1) Temp
  • NXP® i.MX 8QuadMax
  • 2x Arm Cortex™-A72, 4x Arm Cortex™-A53
  • 1.6 GHz (A72), 1.26 GHz (A53), 266 MHz (M4)
  • 4GB LPDDR4 (64 Bit)
  • 32GB eMMC
  • -40° to 85° C Temp
  • NXP® i.MX 8QuadPlus
  • 1x Arm Cortex™-A72, 4x Arm Cortex™-A53
  • 1.6 GHz (A72), 1.26 GHz (A53), 266 MHz (M4)
  • 2GB LPDDR4 (64 Bit)
  • 32GB eMMC
  • -25° to 85° C Temp
  • NXP® i.MX 8QuadPlus
  • 1x Arm Cortex™-A72, 4x Arm Cortex™-A53
  • 1.6 GHz (A72), 1.26 GHz (A53), 266 MHz (M4)
  • 2GB LPDDR4 (64 Bit)
  • 32GB eMMC
  • -25° to 85° C Temp
  • USB 3.0: 2x USB-A (Host)
  • USB 2.0: 1x USB-C (DualRole)
  • 2x Gigabit Ethernet
  • Size: 250mm x 200mm
  • USB 3.0: 2x Host
  • USB 2.0: 1x USB-C (DualRole)
  • Gigabit Ethernet
  • Size: 100 x 72 mm (Pico-ITX)
  • USB 3.0: 1x Dual-Role on USB-C, 2x Host on USB-A, 1x Downstream Facing Port (DFP) on USB-C
  • 2x Gigabit Ethernet
  • Size: 250mm x 200mm
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