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NOTE: Apalis Heatsink Type 3 required.

NVIDIA® Tegra™ K1
NXP® Kinetis™ K20 Companion MCU, ARM Cortex™-A15
Cortex™-M4 (Companion MCU), Up to 2.1 GHz (A15)
100 MHz (M4), Quad Core (A15)
Heteregenous (M4 Companion MCU), 2GB DDR3L (64 Bit), 16GB eMMC (8 Bit), 10/100/1000 Mbit IEEE1588 Ethernet, -25° to +85° C Temp. Range, Availability until 2025

NXP^® i.MX 8QuadMax, ARM Cortex™-A72, Cortex™-A53, Cortex™-M4, 1.6GHz (A72), 1.2GHz (A53), 266MHz (M4), Dual Core (A72), Quad Core (A53), Dual Core (M4), 10/100/1000 Mbit IEEE1588 Ethernet, 0° to 70° C
-40° to +85° C Temp. Range, Availability until 2030

NVIDIA® Tegra™ 3, ARM Cortex™-A9, Up to 1.4 GHz, Quad Core, 2GB DDR3L (32 Bit), 8GB eMMC (8 Bit), 10/100/1000 Mbit IEEE1588 Ethernet, 0° to 70° C Temp. Range, Availability until 2025

NVIDIA® Tegra™ 3, ARM Cortex™-A9, Up to 1.4 GHz, Quad Core, 1GB DDR3L (32 Bit), 4GB eMMC (8 Bit), 10/100/1000 Mbit IEEE1588 Ethernet, 0° to 70° C Temp. Range, Availability until 2025

NVIDIA® Tegra™ 3, ARM Cortex™-A9, Up to 1.4 GHz, Quad Core, 1GB DDR3L (32 Bit), 4GB eMMC (8 Bit), 10/100/1000 Mbit IEEE1588 Ethernet, -40° to +85° C Temp. Range, Availability until 2025

NXP^®/Freescale i.MX 6Quad, ARM Cortex™-A9, 800 MHz, Quad Core, 2GB DDR3 (64 Bit), 4GB eMMC (8 Bit), 10/100/1000 Mbit IEEE1588 Ethernet, -40° to +85° C Temp. Range, Availability until 2028

NXP^®/Freescale i.MX 6Quad, ARM Cortex™-A9, 800 MHz, Quad Core, 2GB DDR3 (64 Bit), 4GB eMMC (8 Bit), 10/100/1000 Mbit IEEE1588 Ethernet, -40° to +85° C Temp. Range, Availability until 2028

NXP^®/Freescale i.MX 6Quad, ARM Cortex™-A9, 1.0 GHz, Quad Core, 1GB DDR3 (64 Bit), 4GB eMMC (8 Bit), 10/100/1000 Mbit IEEE1588 Ethernet, 0° to 70° C Temp. Range, Availability until 2028

NXP^®/Freescale i.MX 6Quad, ARM Cortex™-A9, 1.0 GHz, Quad Core, 1GB DDR3 (64 Bit), 4GB eMMC (8 Bit), 10/100/1000 Mbit IEEE1588 Ethernet, 0° to 70° C Temp. Range, Availability until 2028

NXP^®/Freescale i.MX 6Dual, ARM Cortex™-A9, 800 MHz, Dual Core, 1GB DDR3 (64 Bit), 4GB eMMC (8 Bit), 10/100/1000 Mbit IEEE1588 Ethernet, -40° to +85° C Temp. Range, Availability until 2028

NXP^®/Freescale i.MX 6Dual, ARM Cortex™-A9, 1.0 GHz, Dual Core, 512MB DDR3 (64 Bit), 4GB eMMC (8 Bit), 10/100/1000 Mbit IEEE1588 Ethernet, 0° to 70° C Temp. Range, Availability until 2028

Small form-factor Apalis ARM Computer Module family Carrier Board

Connectivity: USB 3.0: 2x Host, USB: 1x Host (High Speed)
1x OTG (High Speed), 10/100/1000 Mbit Ethernet, 2x I2C, 1x SPI, 4x PWM, 4x ADC, 2x CAN, 2x LEDs, up to 40 GPIOs

Multimedia: Audio out: 1x (Stereo), Audio in: 1x (Stereo), 1x S/PDIF In / Out, 1x Camera Parallel Interface, 4/5-wire Resistive Touch

Physical: 7-27V DC Supply Voltage, 5V 5A
3.3V 5A On-Board Power Supplies, Size: 125 x 90 mm

Connectivity: USB 3.0: 1x Host, 1x OTG, USB: 4x Host (High Speed), 10/100/1000 Mbit Ethernet, 3x I2C, 2x SPI, 4x PWM, 4x ADC, 2x CAN, 8x Switches, 8x LEDs, up to 135 GPIOs

Multimedia: Audio out: 1x (Stereo), Audio in: 1x (Stereo), 1x S/PDIF In / Out, 1x Camera Parallel Interface, 4/5-wire Resistive Touch

Physical: 7-27V DC Supply Voltage, 5V 5A
3.3V 5A On-Board Power Supplies, Size: 250 x 250 mm

Heatsink for Apalis iMX6Q IT and Apalis iMX6D IT modules

Compatible with Apalis iMX6Q IT and Apalis iMX6D IT, Contains the TIM (Thermal Interface Material) and 4 screws, Easily mounted to the Apalis Carrier Boards by means of 4 screws, Additonal threaded holes available for attaching fan to the carrier board.

Heatsink for Apalis T30 module

Compatible with Apalis T30, Contains the TIM (Thermal Interface Material) and 4 screws, Easily mounted to the Apalis Carrier Boards by means of 4 screws, Additonal threaded holes available for attaching fan to the carrier board.